崔成強，教授，高級工程師。廣州科技創新“百人計劃”引進人才 ，江蘇省“雙創人才”，蘇州市姑蘇領軍人才；曾獲新加坡李光耀頂尖研究獎，海外研究獎學金、中英友好研究獎學金；曾任中國兵器工業集團首席專家，安捷利實業和香港金柏科技首席技術官；香港科技大學霍英東研究院兼職教授；常州半導體照明國家重點實驗室客座研究員，香港應用科學院顧問；曾主持國家02專項、863計劃等多項科技攻關與技術創新項目。有着超過20年的微電子封裝材料及工藝領域研究工作經曆。截至2017年，已累計獲得國内外授權發明專利32項，授權實用新型專利8項，申請發明專利64項。已在國内國際著名雜志期刊上發表論文110餘篇。
Cu fully filled ultra-fine blind via on flexible substrate for high density interconnect, 31st IEMT’2006, Putrajaya, Malaysia, Page: 13-19, 8-10 November, 2006.
Cu fully filled ultra-fine blind via on flexible substrate for high density interconnect, 31st IEMT’2006, Putrajaya, Malaysia, 13-19, 8-10 November, 2006.
TBGA substrate for lead free and halogen-free application, 2004 International IEEE Conference on Asian green electronics (AGEC), City University of Hong Kong, Jan. 5-6, 2004.
Ultra-fine via with filled solid Cu, IPC/TPCA Conference: Flex &Chips, Taiwan, 9-10 November, 2004.
High density interconnect on flexible substrates, IEEE/CPMT dinner meeting, Santa Clara, 9 September, 2004.
Byron Chan, Alex C K So, Thomson Lee, Chee Cheung, Development of Two-Metal Layer Flexible Substrate for High Density IC Packaging , EMAP2000, Hong Kong, pp.326-329, 2000.
XPS Study on RuO2 Electrode, J. Xiamen University (Natural Science), 27, 76-80, 1988.
Effects of Oxygen Reduction on Nickel Deposition from Unbuffered Aqueous Solutions, Part II—Characterization of the Electrode Interface in Electrodeposition", J. Electrochem. Soc., 142, 1132-1138, 1995.
Nickel Deposition from Unbuffered Neutral Chloride Solution in the Presence of Oxygen, Electrochim. Acta, 40, 1653-1662, 1995.
Degradation of Copolymers of Aniline and Metanilic Acid, Polymer Degradation and Stability, 43, 245-252, 1994.
Effect of Polyaniline on Oxygen Reduction in Buffered Neutral Solution, J. Electroanal. Chem., 367, 205-212, 1994.
Reactive Deposition of Ultrafine Cobalt Powders, Part Two—Effect of Preparation Condition, J. Materials Science, 29, 6495-6500, 1994.
Effects of Oxygen Reduction on Nickel Deposition from Unbuffered Aqueous Solutions, Part I—Deposition Process and Deposit Structure", J. Electrochem. Soc., 141, 2033-2038, 1994.
Reactive Deposition of Ultra-fine Cobalt Powders, Part I: Electrochemical Studies, J. Materials Science, 28, 461-468, 1993.
Extent of Incorporation of Hydrolysis Products in Polyaniline Films Deposited by Cyclic Potential Sweep, Electrochim Acta, 38, 1395-1404, 1993.
Origin of Difference between Potentiostatic and Cyclic Potential Sweep Deposition of Polyaniline, J. Electroanal. Chem., 346, 477-482, 1993.
Measurement of the Extent of Impurity Incorporation during Potentiostatic and Cyclic Potential Sweep Deposition of Polyaniline, Synthetic Metals, 58, 147-160, 1993.
Measurement and Evaluation of Polyaniline Degradation, Polymer Degradation and Stability, 41, 69-76, 1993.
崔成強，一種新型的封裝基闆及其制作方法，2015.8.5，中國，ZL201410425401.1
崔成強，王健，一種芯片的封裝方法，2014.4.8，中國，201410138323.7
崔成強，王健，一種用于芯片封裝的引線框架的制備方法, 2014.4.8，中國，201410138222.X
崔成強，一種鍍有阻性材料的銅箔的制造方法, 2014.8.26，中國，201410424188.2
崔成強，一種新型的封裝基闆及其制作方法,2014.12.29，中國，PCT/CN2014/093408
崔成強，王健，陳勇，一種層間互聯的工藝，2014.12.17，中國，201410775664.5
崔成強，新型埋入元器件的封裝結構及電路闆，2014.12.24，中國，ZL201420484667.9
崔成強，王健，一種封裝芯片，2014.9.10，中國，ZL201420167806.5
崔成強，韋嘉，袁長安，張國旗，制造發光二極管芯片的方法，2013.7.9，中國，201310286849.5
崔成強，袁長安，張國旗，LED封裝結構及其制作方法，2013.5.27，中國，201310201587.8
崔成強，梁潤園，韋嘉，袁長安，LED封裝結構及其制作方法，2013.1.4，中國，201310001095.4
崔成強，一種疊加電路闆，2013.3.27，中國，ZL201220405079.2
崔成強，黃潔瑩，梁潤園，袁長安，張國旗，一種LED 封裝體的制作方法，2012.11.28，中國，ZL201210497327.5
崔成強，梁潤園，韋嘉，袁長安，LED芯片及制造方法，2012.12.28，中國，201210587583.3
崔成強，一種柔性電路闆的盲孔制作工藝，2012.8.16，中國，201210290774.3
崔成強，一種耐外力作用的高可靠性的帶凸包互連電路闆，2012.11.21，中國，ZL201220145402.7
崔成強，柔性無膠銅電路闆基材及其制作工藝，2012.8.16，中國，201210290819.7
崔成強，一種高密度線路闆的制造工藝，2016.3.3，中國，ZL201210290786.6
C.Q.Cui and Chee W Cheung, Multiple integrated circuit die package with thermal performance, US 7, 906,844, Mar. 15.2011
C.Q.Cui, Kai C. Ng and Chee W. Cheung, Die-up integrated circuit package with grounded stiffener , Aug. 11, 2009, US 7, 573,131
